Micro-punching process based on spallation delamination induced by laser driven-flyer

Abstract

In this article, we proposed a micro-punching process for microstructure on films based on laser driven-flyer induced spallation delamination phenomenon at the interface between a film and its substrate. To validate such a micro-punching process, a series of experiments were carried out for fabrication of microstructures on Au films coated on K9 glass substrates and polyimide substrate. Results show that through such a punching process, the microstructure on Au films can be fabricated efficiently and the spatial resolution is able to reach micron level. Moreover, we found that this method was more suitable for films coated on soft substrates rather than that coated on brittle substrates due to the additional destruction of the brittle substrate. This micro-punching process has a wide range of potential application in microfluidic devices, biodevices and other MEMS devices.