Abstract
Glass micromachining is currently becoming essential for the fabrication of micro-devices, including micro- optical-electro-mechanical-systems (MOEMS), miniaturized total analysis systems (μTAS) and microfluidic devices for biosensing. Moreover, glass is radio frequency (RF) transparent, making it an excellent material for sensor and energy transmission devices. Advancements are constantly being made in this field, yet machining smooth through-glass vias (TGVs) with high aspect ratio remains challenging due to poor glass machinability. As TGVs are required for several micro-devices, intensive research is being carried out on numerous glass micromachining technologies. This paper reviews established and emerging technologies for glass micro-hole drilling, describing their principles of operation and characteristics, and their advantages and disadvantages. These technologies are sorted into four machining categories: mechanical, thermal, chemical, and hybrid machining (which combines several machining methods). Achieved features by these methods are summarized in a table and presented in two graphs. We believe that this paper will be a valuable resource for researchers working in the field of glass micromachining as it provides a comprehensive review of the different glass micromachining technologies. It will be a useful guide for advancing these techniques and establishing new hybrid ones, especially since this is the first broad review in this field.
Highlights
Micromachining is one of the most important aspects among state-of-the-art manufacturing technologies
It may result in cracks due to deformation of glass by the thrust force of the drill acting at the bottom surface of the workpiece [23,24,25]
In order to improve the efficiency of ultrasonic machining of glass, hydrofluoric (HF) acid is added to the abrasive slurry but in low concentrations, normally less than 5% hydrofluoric acid (HF) solution [85]
Summary
Micromachining is one of the most important aspects among state-of-the-art manufacturing technologies. In the constantly emerging field of micro-electro-mechanical-systems (MEMS) and miniaturized total analysis systems (μTAS), silicon and glass are the primarily used materials. Many applications need glass because of its unique properties [1,2,3,4,5,6,7,8,9,10]. The micro-optical-electromechanical-system (MOEMS) uses glass due to its optical properties, and radio frequency (RF)-MEMS applications take advantage of its good isolation properties [3,4]. Dimensions of the structures to be machined vary from sub-micron to sub-mm and aspect ratios of 0.1 up to 10 or higher. Glass is common as a die for thermal compensation for two of the most commercialized
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