Abstract
An apparatus was specifically developed for micro-friction and adhesion measurements. The force measurement range is 10–2000 μN with a horizontal speed of 10–400 μm/s. The apparatus was tested using a 0.7-mm diameter steel ball as the upper specimen to measure the micro friction and adhesion behaviour of a Si (100) wafer and a TiB 2 film. The effects of rest time, speed, and load were studied. The results show that the maximum static and sliding friction forces of both the Si (100) wafer and the TiB 2 film increase with the load. At low speeds, the influence of speed on the friction force is significant. The adhesion forces of the Si (100) wafer and the TiB 2 film increase with rest time, reaching stable values after about 3000 s. The TiB 2 film has significantly less adhesion and micro friction forces than the Si (100) wafer.
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