Abstract
Counterfeiting, with a global trade volume of approximately 450 billion euro a year compromises business results of companies in all industrial segments. At worst, product plagiarism causes severe damages to the individual brand reputation due to product defects or liability issues. Therefore, product integration of inseparable and unique security features is essential for a preserving market share in all manufacturing branches. This paper presents a novel approach regarding a replication technology for the manufacturing of holographic security features. Using a microstructured aluminium substrate with holographic properties as a base material, a forming die is manufactured by a combination of physical vapour deposition (PVD) and galvanic coating processes. Furthermore, a process adapted hardness progression between individual layers was created. By the use of this die, the forming of a holographic microstructure into high strength aluminium alloy (3.3547) and spring steel (1.1248) could be demonstrated within a preliminary study.
Highlights
Holographic labeles are accepted security features for large-scale consumer goods in the form of adhesive tags
This paper presents a novel approach regarding a replication technology for the manufacturing of holographic security features
Using a microstructured aluminium substrate with holographic properties as a base material, a forming die is manufactured by a combination of physical vapour deposition (PVD) and galvanic coating processes
Summary
Holographic labeles are accepted security features for large-scale consumer goods in the form of adhesive tags. The challenging process chains for the manufacturing of holographic structures by ultraprecision machining or lithographic techniques causes a reliable and cost-efficient technology for the application of holograms on product surfaces. These are needed to increase the acceptance of holograms as security features. Due to the process forces and the effect on the wear of the stamping die, the replication of microstructures into metallic substrates has not been accepted For this reasons, design and evaluation of a process-adapted stamping die are the subject of the investigation presented
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