Micro Channel Vapor Chamber for high heat Spreading

Abstract

The cooling technology that is most widely used for computers is air-cooling, because this is a mature technology with the least operation and maintenance cost. In order to push the limit of the air-cooling capability, enhancement of heat transfer from the processor to cooling medium is needed. Recently, the processor has multi-cores such as dual-cores, quad-cores. So, the heat dissipation from the processor surface is not uniform. For effective cooling, it is required least temperature gradient between the heat source and radiating componets. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chambers, which are two-phase heat transfer devices with excellent heat spreading ad heat transfer characteristics. In this paper, various designs using vapor chamber for CPU (Central Processor Unit) are presented with advanced technology of micro channel wick structure instead of traditional sintered powder wick.