Abstract
Abstract The authors present a new approach to deformation analysis based on localized correlation analysis on load state images. Displacement and strain fields are extracted from images, originating from different kinds of highest resolution equipment, e.g., from scanning electron and scanning force microscopes. As a result, object load response can be recorded within microscopic or nanoscopic material areas. This unique technique is utilized for deformation mapping as well as for direct determination of thermo-mechanical material properties. The method has been established as microDAC/nanoDAC for strain field mapping and as mTest for the measurement of material properties, currently for coefficients of thermal expansion (CTE) and Poisson ratios. This paper includes an introduction in the measurement technique, a view on the method’s capability and the developed hardware for mechanical and thermal testing. The application of the tools is illustrated by examples from electronics and microsystem packaging. Deformation measurements on chip scale packages and measurement of CTE are discussed more in detail. Front-end application of correlation techniques using atomic force microscope imaging is demonstrated.
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