Abstract
Materials used in laminated circuit boards must be dimensionally stable at elevated operating temperatures and tough at room temperature to be cold-punchable. Certain polymeric materials with two or more thermal transitions have the desired combination of properties. Two novel methods for determining these transitions were developed. The first utilizes a single cured lamination of the circuit board material in low-frequency dynamic mechanical studies in the temperature range from - 180°C to + 200°C. It is useful in predicting the role of plasticizer content in improving punchability. The second method involves determination of the crack arrest temperature of the complete laminate. It is a close analog to cold punching and can be used to predict safe punching temperatures. Both methods have been correlated with a visual examination of the cold-punched laminates. Two of the transitions observed by dynamic mechanical property studies were substantiated by differential thermal analysis measurements.
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