Abstract
Subsurface damage is easily induced in machining of hard and brittle materials because of their particular mechanical and physical properties. It is detrimental to the strength, performance and lifetime of a machined part. To manufacture a high quality part, it is necessary to detect and remove the machining induced subsurface damage by the subsequent processes. However, subsurface damage is often covered with a smearing layer generated in a machining process, it is rather difficult to directly observe and detect by optical microscopy. An efficient detection of subsurface damage directly leads to quality improvement and time saving for machining of hard and brittle materials. This paper presents a review of the methods for detection of subsurface damage, both destructive and non-destructive. Although more reliable, destructive methods are typically time-consuming and confined to local damage information. Non-destructive methods usually suffer from uncertainty factors, but may provide global information on subsurface damage distribution. These methods are promising because they can provide a capacity of rapid scan and detection of subsurface damage in spatial distribution.
Highlights
Hard and brittle materials are widely used because of their excellent physical and mechanical properties, such as high hardness and strength at elevated temperatures, wear and corrosion resistances, etc
Among hard and brittle materials, single crystalline silicon is the predominant substrate material for integrated circuits (IC) [1,2,3,4,5]; optical glasses are for optical windows and lens [6,7,8,9,10,11] as well as high-power laser components [12]; ceramic materials are commonly used for bearings, cutting tools and machine parts [13,14,15,16]
This paper provides a review of the methods for detection of subsurface damage
Summary
Hard and brittle materials are widely used because of their excellent physical and mechanical properties, such as high hardness and strength at elevated temperatures, wear and corrosion resistances, etc. Surface and subsurface damage (SSD) is often induced in a machined part made of such a material. BIT has a limited application to measuring subsurface damage in the parts made of ceramics, optical glasses and other hard and brittle materials by. BIT cannot provide precise information on subsurface damage induced in the practical machining processes, and should not be recommended for quantitative detection of SSD in hard and brittle materials. The removal of the damage layer stabilizes surface roughness, which facilitates an accurate calculation of SSD depth. The constant-rate etching method has been widely used to measure SSD in optical glasses, ceramics, and semiconductor materials [2, 22, 50,51,52]. Where ag is the maximum cutting depth of abrasive grains, taking the form shown in Eq (4); λ is constant, and λ=10−2m1/2; m is the working condition coefficient,
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