Abstract
A methodology of process evaluation for statistical process control is proposed. Process control is accomplished with new wafer-mapping techniques, uniformity evaluation methods, and correlation analysis methods. Using these methods, uniformities of the processing and device characteristics of a wafer are so convenient and precisely evaluated that they will be essential for the development of high-performance ULSI technologies. >
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
