Abstract
A solder-joint crack due to thermal fatigue affects the reliability of light emitting diode assemblies. A new methodology is presented for the solder-joint lifetime estimation under a wide range of working conditions. The proposed method is based on the combination of reliability design of experiments, computer aided structural analysis validated by thermal-cycling experiments, and surface response modeling.
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Schedule a callMore From: IEEE transactions on device and materials reliability : a publication of the IEEE Electron Devices Society and the IEEE Reliability Society
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