Abstract
AbstractModels describing the reactive sputtering process need experimental input for some important parameters as the knock‐on yield, the reaction rate constant, the sticking coefficient on the target and the sticking coefficient on the deposited material. Here, a method is described to calculate the sticking coefficient of O2 on the deposited material, during reactive magnetron sputtering. Mass spectrometry is used to measure local, effective O2 partial pressure during sputtering, at the position of the sample. Combined with electron probe microanalysis of the oxygen content in deposited layers, we calculate the sticking coefficient. At our conditions, a local, effective pressure of (5.26 ± 0.44) × 10−6 mbar was found and an average sticking coefficient of 0.107 ± 0.032 for O2 on deposited aluminium during reactive magnetron sputtering.
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