Abstract
A method to improve the rate of direct plating process based on Pd/Sn activator and sulfide enhancement has been developed. The plating rate can be almost doubled by drying the substrate in an oven for 2 min at 75°C before dipping in the plating bath. Several analytical techniques including potential scan, energy-dispersive spectrometry, electron spectroscopy for chemical analysis, and rest potential measurement have been employed to explore the underlying cause for this acceleration effect.
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