Method for low-temperature compression LCP multilayer circuit

Abstract

At present, the mainstream method of LCP multi-layer lines is to use a layer of low melting point LCP to bond the lines. However, during the high-temperature compression process, LCP will flow and cause the thickness of the circuit to be uneven, which will affect the impedance of the circuit and cause impedance discontinuities. May drift; the lamination temperature of multi-layer LCP lines is too high, and the LCP pressure flow at high temperature can only be pressed at one time, the alignment accuracy is low, and the reliability of the line is affected, and high temperature presses require high temperature presses, which are expensive .This article provides a method for multi-layer LCP low-temperature lamination. Multi-layer liquid crystal polymer (LCP) circuits are obtained by a thin layer of low-temperature vacuum hot pressing. Multilayer LCP lines have little difference in insertion loss at 5G frequency, and there is no bubble delamination between layers, and the peel strength is high.