Abstract
The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.
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