Abstract
The mixture of three parts acetic acid and one part hydrogen peroxide is probably the most widely used chemical polishing agent for lead and lead alloys. In certain conditions the structure is sufficiently revealed that additional attack is not necessary. However, lead alloys are subject to structural changes (such as aging and recrystallization) at room temperature. We have previously described a technique of electrolytic polishing at −50°C followed by repeated chemical etching with an appropriate reagent at 20°C. The applications of this technique are various: observation of the not-yet-transformed structure, determination of the transformation sites (intercrystalline or intracrystalline), movement of transformation fronts along specific crystallographic planes, measurement of the transformation front movement at different temperatures, and estimation of the transformed volume and of the activation energy associated with the transformation process. Classical soldering lines between two lead alloys of a different kind or between two alloys of the same kind can also be observed using this technique. However, the technique is not suitable in other cases, such as solderings obtained by extrusion. A new technique of deep dissolution has now been developed that allows us to reveal the soldered extruded zones. It consists of chemical dissolution with a mixture of one part acetic acid and three parts hydrogen peroxide.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
