Abstract
The paper deals with the adhesion of copper films deposited using the ion plating technique onto polytetrafluoroethylene (PTFE) substrates. The substrates were biased by an r.f. voltage; copper was evaporated by electron bombardment. The results showed that careful sputter cleaning in an argon-oxygen (or helium- oxygen) mixture is essential to achieve good adhesion. Diagnostics by IR spectroscopy indicated that sputter cleaning in pure argon induced some damage at the substrate surface and that PTFE chains were broken. Microscopic inspection gave evidence that sputter cleaning in an argon-oxygen mixture increased the roughness of the substrate surface. Results of adhesion strength measurements for silver films on PTFE substrates after reactive sputter cleaning are presented and discussed. The formation of CuOCbonds at the interface is assumed to play an essential role.
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