Metallization of polymer composites by metalorganic chemical vapor deposition of Cu: Surface functionalization driven films characteristics

Abstract

The present work is an evaluation of the most efficient pretreatments that are used in the field of metallization of poly-epoxies. In particular, we treat the case of MOCVD metallization with the constraints of limiting preparation steps and non-null, though limited thermal budget, and obtaining smooth, adherent, and highly conductive Cu coatings. Several results are presented after applying ex or in situ mechanical and chemical treatments. For the first time, transmission electron microscopy investigations illustrate the effect on the coating of H2O vapor addition during the first steps of the deposition process. In an original manner, we show that the enhancement of surface reactivity displaces the center of mass of the deposit towards the gas entry in the hot-wall reactor. Additionally, with the particularity of the hot-wall configuration, we show that differences in the deposition conditions along the reactor locally place the deposition in different regimes, i.e. diffusional or kinetic, with a strong effect on the coating microstructure and properties. Therefore, for both controlling the film properties and tuning the MOCVD reactor and the processing conditions, surface reactivity must be considered, in addition to the classical macroscopic processing parameters.