Metallization of High Density Polyurethane Surfaces

Abstract

Electroplating onto polymeric materials is required for different purposes in various applications. Polyurethane (PU) is an electrically insulator material and durable at high temperatures. Furthermore, it has high thermal conductivity, low thermal expansion coefficient and is a high density foam. In this study, surface metallization of polyurethane foam, involving activation and sensitization processes, was studied to prepare the surface for subsequent electroplating process. The surface metallization was carried out by multi-step processes which included degreasing, etching, sensitization, activation and electroless nickel plating. Metallized surfaces were tested for electrochemical nickel plating at different current densities and surface morphology, roughness and physical properties of the coatings were characterized. The results showed that increasing current density adversely affects the surface morphology and surface sensitization and activation processes increased the surface conductivity of foam.