Metallization and electrical characterization of platinum thin film microelectrodes on biocompatible polydimethylsiloxane substrates for neural implants

Abstract

Microfabrication technology in the biomedical field has provided microelectrode arrays for neural implants with new development opportunities. The need for more complex physiological functions and miniaturization, as well as the use of new materials for more flexible electrodes, can now be satisfied. PDMS (Polydimethylsiloxane) substrates are elastic, biocompatible and permeable to oxygen, in addition to being a highly stable material. However, the implementation of microfabrication techniques such as deposition and patterning processes on these new substrates is not straightforward. This paper will describe the development of a reliable method to metalize thin film microelectrodes on a highly flexible medical grade PDMS layer that is suitable for long-term implantation. Platinum (Pt) microelectrodes were deposited by physical vapor deposition and pattern transfer by lift-off was chosen. Standard photolithography was used to pattern a conventional positive photoresist and was optimized to improve adhesion and to avoid cracks in the resist. The electrical behavior of the metal-polymer interface was analyzed using multiplexed DC measurements. The resistance values of seven samples and a control were acquired sequentially. Special attention was paid to the connectorization from the flexible microelectrodes to a rigid substrate. Measurements were carried out in an air-protected environment as well as in a biological environment designed to mimic the environment of the human body. Long-term stability of the Pt-PDMS interface was strongly influenced by the electrode configuration and its connection. A characteristic electrical behavior was observed for a straight-electrode configuration. This configuration demonstrated significant drift of resistance values of more than 4% during the initial 56h. By contrast, a stable behavior was observed for a loop electrode design, with only small variations of less than ±0.5% caused by thermal fluctuations.