Abstract
We propose and demonstrate a low cost technique to fabricate submicrometer sieves using the association of laser interference lithography and nickel electroforming. The sieves are fabricated on glass substrates and are released from the substrate by adding a hexagonal sustaining structure, electroformed in nickel, using conventional lithography. The resulting sieves are free self-sustained membranes similar to those used in filtration devices, with typical diameters of the holes of about 250 nm and areas of about 1 cm2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
