Abstract

Ultra High Molecular Weight Polyethylene with a reduced number of entanglements can be stretched in the solid state both uni- or biaxially to produce highly oriented tapes and films. The chain orientation, in combination with the reduced number of chain ends, is responsible for the high tensile modulus and tensile strength of the drawn materials, and, as we report here, also for the high thermal conductivity achieved through lattice movements. A property such as thermal conductivity in an electrical insulator makes UHMWPE tapes and films of great applicative interest. In-plane laser-flash thermal analysis has been applied to measure the thermal diffusivity of samples of different molecular weights stretched both uni- and biaxially, and a strong correlation has been found between the drawing ratio and the resulting in-plane thermal conductivity. Values of at least 40 W/m K have been achieved for UHMWPE having Mw comprised between 2 and 10 million, while higher values of 65 W/m K are observed for the higher Mw samples having relatively lesser number of chain ends. Surprisingly the biaxially stretched samples also show in-plane conductivity, with the highest value reaching 18 W/m K, comparable to stainless steel.

Highlights

  • Heat transfer in any material can happen by particle collisions and/or lattice vibrations, where the first mechanism is usually more effective than the latter

  • We have realized a series of Ultra-High Molecular Weight Polyethylene (UHMWPE) tapes varying in molecular weight/distribution and degree of stretching, realized both uniaxial and bi-axial, and we have evaluated the thermal conductivity by means of the laser-flash thermal analysis apparatus described in the experimental section

  • To evaluate the influence that the two different processing steps have on the polymer chain orientation, a sample having weight average molecular weight Mw 1⁄4 6.4 Â 106 g/ mol and a molecular weight distribution, MWD 1⁄4 6.8 has been subjected to different ratios of rolling and stretching

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Summary

Introduction

Heat transfer in any material can happen by particle collisions and/or lattice vibrations, where the first mechanism is usually more effective than the latter. With the addition of suitable amounts of thermally conductive fillers, polymer composites that are thermally conductive but still electrically insulating have been realized to be used in various industrial applications including circuit boards in power electronics, heat exchangers, and electronic appliances. These composites usually require high loading of fillers to achieve practical values of conductivity, due to a large interfacial thermal resistance (Kapitza resistance) between the filler and the surrounding polymer matrix [2]. This constitutes a significant processing challenge and poses serious problems for recycling of the material after use

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