Abstract
The cleanliness of Au, Cu and Sn surfaces by Ar fast atom beam (FAB) and Ar-plasma treatment was investigated using X-ray photoelectron spectroscopy (XPS). Oxides and organic residues can be removed and clean metal surfaces can be achieved using Ar-FAB activation. The vacuum background of Ar-plasma pretreatment influenced the cleanliness to metal surfaces. The influence of surface cleanliness was investigated by bonding micro-bumps of Au/Sn and Sn-Ag-Cu micro-bumps at 25–100°C. Au/Sn micro-bumps were successfully bonded t to Au and Cu thin films and Au/Sn micro-bumps at room temperature. Regardless of the vacuum background, Ar RF plasma pretreatment improves the bondability of Au/Sn and Sn-Ag-Cu micro-bumps at low temperatures in ambient air.
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