Abstract
Traditional manufacturing approaches to embed active materials, such as piezoelectrics, into metals can be problematic due to their high process temperatures or long curing times of the adhesives utilized to bond the active component to the metal. This paper presents the development and characterization of aluminum embedded with a piezoelectric polyvinylidene fluoride (PVDF) sensor using a low-temperature, solid-state metal joining process called ultrasonic additive manufacturing (UAM). The embedded sensor is subjected to a pre-compression that is empirically optimized by varying the depth of the pocket and tape foils welded above the sensor, thus eliminating reliance on a bonding medium to mechanically couple the metal and the sensor. The technology presented in this study could enable rapid fabrication of functionalized metal structures that can be used in non-destructive testing, energy harvesting, and load monitoring applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
