Abstract

Up until recently, thin film growth by magnetron sputtering relied on enhancing adatom mobility in the surface region by gas-ion irradiation to obtain dense layers at low deposition temperatures. However, an inherently low degree of ionization in the sputtered material flux during direct-current magnetron sputtering (DCMS), owing to relatively low plasma densities involved, prevented systematic exploration of the effects of metal-ion irradiation on the film nanostructure, phase content, and physical properties. Employing only gas-ion bombardment results in an inefficient energy and momentum transfer to the growing film surface. Also, for enhanced substrate biasing, the higher concentration of implanted noble gas atoms at interstitial lattice positions causes elevated compressive stress levels. High-power impulse magnetron sputtering (HiPIMS), however, provides controllable metal-ion ionization and, more importantly, enables the minimization of adverse gas-ion irradiation effects. The latter can be realized by the use of pulsed substrate bias applied synchronously with the metal-ion-rich portion of each HiPIMS pulse (metal-ion-synchronized HiPIMS), based on the results of time-resolved ion mass spectrometry analyses performed at the substrate position. In this way, both the metal-ion energy and the momentum can be precisely controlled for one to exploit the benefits of irradiation by metal-ions, which are also the film-forming species. Systematic studies performed in recent years using binary and ternary transition metal-based nitrides as model systems revealed new phenomena with accompanying unique and attractive film growth pathways. This Perspective paper focuses on the effects of low-mass metal-ion irradiation and their role for the nanostructure and phase control. We review basic findings and present original results from ion mass spectrometry studies and materials characterization for the effect of metal-ion subplantation. Key correlations are highlighted, which, if properly engaged, enable unprecedented control over film nanostructure and phase formation and, hence, the resulting properties. We show generalization from the findings to present a new concept for thin film growth in a hybrid HiPIMS/DCMS configuration with metal-ion-synchronized bias. Based on the results obtained for TM-based nitrides, there are no evident physical limitations preventing the extension of this deposition process concept for other materials systems or other metal–ion-based thin film growth techniques. Further exciting findings could, thus, be anticipated for the future.

Highlights

  • During low-temperature film growth by magnetron sputtering, ion irradiation of the growing film surface is commonly used to eliminate porosity and provide a means for changing layer nanostructure, crystal phase, and texture.1–5 Since conventionally used direct-current magnetron sputtering (DCMS) has a very low ionization of the sputter-ejected material,6 these advantages are almost exclusively due to the gas ions from the sputtering gas mixture

  • High-power impulse magnetron sputtering (HiPIMS), provides controllable metal-ion ionization and, more importantly, enables the minimization of adverse gasion irradiation effects. The latter can be realized by the use of pulsed substrate bias applied synchronously with the metal-ion-rich portion of each HiPIMS pulse, based on the results of time-resolved ion mass spectrometry analyses performed at the substrate position

  • These attractive features of metal-ion irradiation were to some extent utilized in ionized physical vapor deposition,11 cathodic arc deposition,14 plasma immersion ion implantation and deposition,15 and, eventually, in high-power impulse magnetron sputtering (HiPIMS)

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Summary

INTRODUCTION

During low-temperature film growth by magnetron sputtering, ion irradiation of the growing film surface is commonly used to eliminate porosity and provide a means for changing layer nanostructure, crystal phase, and texture. Since conventionally used direct-current magnetron sputtering (DCMS) has a very low ionization of the sputter-ejected material, these advantages are almost exclusively due to the gas ions from the sputtering gas mixture. A better mass match between incident ion and the film-forming atoms implies more efficient energy and momentum transfer to the growing film surface, which enables lower growth temperatures by substituting thermally induced mobility for that provided by ion irradiation.12,13 These attractive features of metal-ion irradiation were to some extent utilized in ionized physical vapor deposition, cathodic arc deposition, plasma immersion ion implantation and deposition, and, eventually, in high-power impulse magnetron sputtering (HiPIMS).. The above phenomenon opened new research directions for thin film growth by magnetron sputtering by enabling selective control of metal-ion energy and momentum.43 This is achieved by the application of substrate bias pulses synchronized to the metal-ion-rich portion of the HiPIMS pulses using as an input the results of time-resolved ion mass spectrometry analyses of ion fluxes incident at the growing film surface, the technique we refer to as metal-ion-synchronized HiPIMS.. We end with a summary and outlook for possible future developments in this field

TIME-RESOLVED ION MASS SPECTROMETRY AT THE SUBSTRATE POSITION
FILM GROWTH WITH METAL-ION SUBPLANTATION
Metal-ion subplantation
Ti1–xSixN
V1–xAlxN
Findings
SUMMARY AND OUTLOOK
Full Text
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