Metal electrodeposition on self-assembled monolayers: a versatile tool for pattern transfer on metal thin films

Abstract

Self-assembled monolayers (SAMs) of thiols on metals have attracted considerable scientific interest because their wide range of applications including their potential use for serial fabrication of nano/microstructures. Different methods have been proposed involving SAM patterning by different techniques. The patterned SAM is then used as a resist for etching, deposition on the uncovered regions or for self-assembly on the patterned SAM surface. In this work new applications of SAM-covered metals based on their excellent anti-adherent properties and their ability to allow pattern transfer from a metallic substrate to metal or alloy electrodeposits are presented. We have used electrodeposition on SAM-covered electrodes to prepare thin standing-free metal or alloy films, for patterning metal and alloy surfaces in the micro- and meso- scale, and to fabricate metallic molds and replicas of metallic masters. The SAM-covered molds produced by this technique can also be used for patterning soft and rigid polymeric films. The method is fast, inexpensive and requires only basic instrumentation available at any chemical laboratory.