Mesoscopic systems: bridging from micromachined devices to macroscopic systems

Abstract

Mesoscopic systems are the bridge forming the micromachining domain into the macro-world. Additional challenges and opportunities are presented by mesoscopic systems. They require more 3-dimensionality than micromachined structures, provide the mechanical interface to the environment (i.e. act as the package) and must resolve the difference in tolerances between the macro-fabricated devices and the high precision microfabricated devices. An ideal fabrication technology for mesoscopic system is deep X-ray lithography (DXRL) and assembly. The high precision in the X, Y and Z dimensions of the DXRL-fabricated components provide unique opportunities for increased functionality and 3-dimensionality of mesoscopic systems. The fabrication, assembly, tolerance and metrology issues of DXRL fabrication of mesoscopic systems are presented. Application of these design issues to mesoscopic fluidic systems will be presented, with specific examples including a magnetically coupled gear pump, a gear pump driven directly by miniature brushless DC motor, and the fluid flat-pack, a general purpose packaging methodology for fluidic devices.