Meso-scale investigation on the deformation and failure behaviors of plain woven SiC/SiC with holes

Abstract

For plain woven SiC/SiC composites used in the aerospace thermal-structural applications, not only the pristine material properties but the open-hole performance are of critical concern for the components in service. In the present study, the influence of fiber preform and manufactured hole on the macro mechanical properties of plain woven SiC/SiC were investigated experimentally. Tensile tests at room temperature were conducted on SiC/SiC specimens with different hole apertures and configurations, and digital image correlation (DIC) method was used for full field strain measurement. The results showed that mesoscopic deformation and failure of pristine SiC/SiC specimens during tensile loading were closely related to the mesoscopic structure of plain woven fabrics. The notch sensitivity of SiC/SiC strength is weak, and the local mesoscopic deformation of the notch is affected by the work of macroscopic stress gradients and mesoscopic structures.