MEMS technologies for enabling high frequency communications circuits

Abstract

Wireless systems requirements for increased data capacity and decreased size and power consumption have pushed radio frequency integrated circuit (RFIC) technology to extremes. Microelectromechanical systems (MEMS) techniques have been used to demonstrate high-efficiency microwave components that provide a means for economically extending silicon RFIC technology to microwave frequencies to meet these demands. MEMS techniques are also being applied to create cost-effective integrated circuits that can function efficiently at millimeter wavelengths and beyond, to further exploit the advantages of increased bandwidth, reduced size, and unique propagation characteristics available at these higher frequencies. An overview is presented here, of recently demonstrated high-frequency MEMS components and techniques that can enhance existing microwave communications circuits and enable economical wave communications.