Abstract
Low Temperature Cofired Ceramic (LTCC) material can be used as a reliable multilayer substrate material for silicon based MEMS component packaging due to many benefits like hermeticity, good match of thermal expansion coefficient (TCE) to silicon to minimise packaging-induced thermomechanical stresses, and the possibility to make cavities into the structure. The applicability of LTCC technologies for MEMS packaging is described in this paper. A review of the technologies used in making LTCC modules, such as substrate manufacturing, interconnecting, sealing and protection, and the benefits of LTCC for MEMS packaging is presented. Also examples on the use of LTCC technology for MEMS sensor packaging are discussed.
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