Abstract

Large area p–i–n diode structures based on amorphous hydrogenated silicon can be used as single element image sensors where the information is read out by a scanning laser beam. A high sensitivity is reached with silicon–carbon alloy contact layers. The higher defect density in the large band gap material is usually a problem for efficient carrier collection in solar cell applications. When used as an image sensor, however, the charge stored in deep defects represents an easy way to realize short-term image storage. In the case of a p-(Si:H)/i-(Si:H)/n-(Si x C 1− x :H) sensor structure we have measured a memory effect of approximately 1% after several minutes of image projection. Metastable sensor degradation is observed in accordance with the Staebler–Wronski effect. Fast degradation of sensor performance — corresponding to 90% erasable image storage capability — was studied in an unalloyed structure using a Nd:YAG laser system. The response can be modeled by a stretched exponential decay with parameters depending on the laser pulse energy.

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