Abstract
Metal whisker growth poses a significant reliability threat to electronic devices. Previous investigations have predominantly focused on metal platings and alloy solder samples, yet the intricate factors involved have yielded inconsistent comprehension of the phenomenon. To achieve a comprehensive understanding, exploring intermetallic compounds (IMCs) may offer a novel standpoint. Herein, we present the first report on the growth of single crystal cadmium (Cd) whiskers on Ti2Cd IMC, accompanied by the characterization of their composition, crystal structure, and morphological features. Furthermore, the influence of mechanical damage and temperature on the whisker growth is examined. Ball milling induces the decomposition of Ti2Cd, liberating active Cd atoms with elevated chemical potentials that consequently feed the whisker growth. These findings augment the existing knowledge on the topic of the metal whisker growth and provide fresh perspectives and references for further investigations in this field.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
