Mechanisms of structural-phase transformations during crystallization of a solder melt

Abstract

Problem statement. An important requirement is quality assurance of joining materials with minimal overheating of materials, lowering the soldering temperature and suppressing the interaction of the solder with the materials to be soldered. The heating of the solder and the holder should be as uniform as possible and with a minimum temperature difference along the depth. One solution may be to develop more efficient solders and fluxes, adapted to the high heating rates that are typical when using high frequency currents Purpose. Thus, the problems of uniform heating of parts during brazing are relevant. This is necessary for optimal distribution of the electromagnetic field in the contact area Methodology. The effect of the heating rate was investigated. The composition of the flux and solders on the microstructure of the solders and the brazed seam was performed on the joints of HV510 (DIN), HS345 (DIN), HG30 (DIN) hardmetal plates with steel holders made of 5135 (USA) steel with a section of 25×20. Results. The research of the processes showed that during the contact interaction of low-melting and refractory components of the solders, when the tool was soldered, the solder is formed in the seam and proceeds through several stages. Practical value. Contact interaction of copper-zinc melts with iron particles does not lead to complete dissolution of iron particles. This is explained to the low values of the solubility of iron in copper-zinc melts despite the fact that resistive heat release occurs in the particles. Such iron particles (iron-based alloy) act as a dispersed phase in the structure of the composite material.