Mechanisms of interdiffusion in copper/nickel thin-film couples

Abstract

Mechanisms of interdiffusion in copper/nickel thin-film couples have been investigated in the temperature interval 573–777 K by in situ measurement of contact resistance, Auger depth profiling (ADP), and transmission electron microscopy. Correlation between evolution of contact resistance and measured Auger concentration profiles has been established and mechanisms incorporating rapid grain boundary diffusion, followed by defect-assisted diffusion into grain interiors (Type B kinetics), are proposed to explain the accelerated reactions observed. A modified Whipple model and two independent methods, based on ADP and contact resistance measurements, are used to calculate grain boundary and intragranular diffusion coefficients, respectively. The calculated grain boundary diffusion coefficient is (0.82 cm2/s) exp(−1.48eV/kT) for nickel in copper, and approximately 4×10−13 cm2/s for copper in nickel at 673 K. An average intragranular diffusion coefficient for nickel in copper is determined to be (2.6×10−6 cm2/s) exp(−1.38 eV/kT) by both methods, whereas ADP data yield a corresponding value of (5.2×10−8 cm2/s) exp(−1.51eV/kT) for copper in nickel. It is concluded that characterization of chemical composition and microstructure, combined with in situ measurement of concomitant electrical properties, provides a reliable description of interdiffusion mechanisms in this system.