Abstract
The high-temperature creep crack growth behavior of pure Cu, Cu--Sn alloy, and predamaged Cu has been investigated. The purposes of this study have been to understand the mechanisms of creep crack growth; to prove theoretical predictions with experimental studies; and eventually to predict the time to failure of high-temperature structural materials. High-temperature crack growth experiments have been conducted under various loading conditions with a computer-based data acquisition and control system. A model to describe creep crack growth in pre-damaged Cu has been developed. It is based on cavity growth by coupled diffusional and creep processes under the damage-modified stress field. High-temperature crack growth experiments have been carried out under cyclic loading conditions. 99 refs., 59 figs., 2 tabs.
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