Mechanisms for nano particle removal in brush scrubber cleaning

Abstract

A model describing the nano particle (<100nm) removal behavior in brush scrubber cleaning is presented based on experiment results and theoretical analysis. The forces on the particles in different situations are analyzed and discussed. The adhesion forces of the van der Waals force, the electrostatic force, the brush load and the static friction between the particle and the wafer are calculated. The contact elastic force, hydrodynamic drag force and friction between the brush and the particle are considered as removal forces and are evaluated. The porous structure and roughness surface of brush material are considered in the hydrodynamic model to describe the brush deformation and the flow field in the cleaning process. The porous structure will result in decrease of hydrodynamic drag force. There are four situations of the particles relative to the brush roughness asperities for which the forces on the particle are different. When the particle is in contact with a brush asperity or on the wafer surface and in a semi-infinite fluid flow field, the particle may be removed by hydrodynamic force and elastic force in the presence of surfactant. When the particle is embedded in the brush asperity, the remove will realized when the friction caused by adhesion between the brush and the particle overcome the adhesion force between particle and wafer surface. The removed particles will be in the flow field or adhered on the brush surface and may redeposit on the wafer surface.