Abstract
In this paper, helium (He) ion irradiations with various fluences were performed on sputtered Cu thin films with a mosaic structure to evolve biaxial stress. X-ray diffraction of the θ–2θ method was used to determine the residual strains in the thin films by measuring the spacing of the crystallographic planes. The results show the in-plane biaxial tensile stress has been reduced by ion irradiation. A new proposed model is discussed to explain the ion-irradiation-induced stress release in mosaic structured Cu thin films.
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