Mechanisms for dose retention in conformal arsenic doping using a radial line slot antenna microwave plasma source

Abstract

Topographic structures such as Fin FETs and silicon nanowires for advanced gate fabrication require ultra-shallow high dose infusion of dopants into the silicon subsurface. Plasma doping meets this requirement by supplying a flux of inert ions and dopant radicals to the surface. However, the helium ion bombardment needed to infuse dopants into the fin surface can cause poor dose retention. This is due to the interaction between substrate damage and post doping process wet cleaning solutions required in the front end of line large-scale integration fabrication. We present findings from surface microscopy experiments that reveal the mechanism for dose retention in arsenic doped silicon fin samples using a microwave RLSA™ plasma source. Dilute aqueous hydrofluoric acid (DHF) cleans by themselves are incompatible with plasma doping processes because the films deposited over the dosed silicon and ion bombardment damaged silicon are readily removed. Oxidizing wet cleaning chemistries help retain the dose as silica rich over-layers are not significantly degraded. Furthermore, the dosed retention after a DHF clean following an oxidizing wet clean is unchanged. Still, the initial ion bombardment energy and flux are important. Large ion fluxes at energies below the sputter threshold and above the silicon damage threshold, before the silicon surface is covered by an amorphous mixed phase layer, allow for enhanced uptake of dopant into the silicon. The resulting dopant concentration is beyond the saturation limit of crystalline silicon.