Abstract
The crack propagation mechanism of Cu nanowires is investigated by using molecular dynamics methods. The microstructural evolution of crack propagation at different strain rates and crack depths is analyzed. Meanwhile, the stress intensity factor at the crack tip during crack propagation is calculated to describe the crack propagation process of Cu nanowires under each condition. The simulation results show that the competition between lattice recovery and dislocation multiplication determines the crack propagation mode. Lattice recovery dominates the plastic deformation of Cu nanowires at low strain rates, and the crack propagation mode is shear fracture. With the increase in strain rate, the plastic deformation mechanism gradually changes from lattice recovery to dislocation multiplication, which makes the crack propagation change from shear fracture to ductile fracture. Interestingly, the crack propagation mechanism varies with crack depth. The deeper the preset crack of Cu nanowires, the weaker the deformation resistance, and the more likely the crack propagation is accompanied.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
