Abstract
Copper and copper-zinc alloys were electrochemical prepared from Cu2O-ZnO mixed oxides in urea and 1-butyl-3-methylimidazolium chloride deep eutectic solvent at 383 K. The electrochemical reduction and nucleation mechanism of copper and copper-zinc alloys were investigated by cyclic voltammetry and chronoamperometry. Cyclic voltammetry showed that copper species [Cu2ClO·urea]− was reduced to copper at − 0.68 V (vs. Ag), while zinc species [ZnClO·urea]− was reduced to zinc and formed copper-zinc alloy at − 1.8 V (vs. Ag). Chronoamperometry indicated that copper particles were electrodeposited by progressive nucleation with diffusion-controlled growth process in urea-BMIC-Cu2O solutions, and the average diffusion coefficient of copper complex ions was determined to be 2.79 × 10−8 cm2 s−1. On contrast, the electrodeposition of copper-zinc alloy proceeded via combination of 3D instantaneous and progressive nucleation. On the other hand, copper and copper-zinc alloys were electroplated on to a stainless steel substrate and characterized by X-ray diffraction, scanning electron microscopy, and energy dispersive spectroscopy.
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