Abstract
Under the interaction of Cu and Ni atoms, interfacial intermetallic compound Cu6Sn5 grains were significantly refined from 22.5 to 4.06 μm after soldering the pre-fabricated Cu6Sn5 with Sn-0.1Ni solder for only 3 min. Ni and Sn atoms were inclined to be adsorbed on (0001) surface but not on (101‾0) and (112‾0) facets of scalloped Cu6Sn5 grains due to the lowest adsorption energy. (Cu,Ni)6Sn5 crystal nuclei nucleated on (0001) surface, grew along [0001] direction to form densely arranged and parallel hexagonal rods, and finally replaced the original larger scalloped Cu6Sn5 grains.
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