Abstract

The discovery of the extremely shallow amorphous boron-crystalline silicon heterojunction occurred during the development of highly sensitive, hard and robust detectors for low-penetration-depth ionizing radiation, such as ultraviolet photons and low-energy electrons (below 1 keV). For many years it was believed that the junction created by the chemical vapor deposition of amorphous boron on n-type crystalline silicon was a shallow p-n junction, although experimental results could not provide evidence for such a conclusion. Only recently, quantum-mechanics based modelling revealed the unique nature and the formation mechanism of this new junction. Here, we review the initiation and the history of understanding the a-B/c-Si interface (henceforth called the “boron-silicon junction”), as well as its importance for the microelectronics industry, followed by the scientific perception of the new junctions. Future developments and possible research directions are also discussed.

Highlights

  • Initiation and History of Boron-Silicon Junctions and Importance ofSi-Based Junctions/Diodes in MicroelectronicsThe first report about an ultra-shallow rectifying junction created by a pure boron atmospheric/low-pressure chemical vapor deposition (AP/LPCVD) on crystalline n-type silicon surface was published in 2006 [1]

  • Since 2006 a significant amount of research has been completed in the following directions: (1) optimization of the critical junction creation process, i.e., the chemical vapor deposition (CVD) of amorphous boron on n-type crystalline silicon; (2) device characterization and design optimization for a variety of applications; and (3) rendering the PureB process CMOS-compatible

  • To gain insight into the preparation processes and the structural and electronic properties of the boron-silicon heterojunction, we modeled the decomposition of B2 H6 molecules and the deposition of BHn (n = 1–4) molecular/radicals on a Si substrate at the early stages of the PureB processes [10,25,26], and Amorphous pure boron (a-B)/crystalline Si substrates (c-Si) interfaces [10,27]

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Summary

Introduction

The first report about an ultra-shallow rectifying junction (diode) created by a pure boron atmospheric/low-pressure chemical vapor deposition (AP/LPCVD) on crystalline n-type silicon surface was published in 2006 [1]. The idea of the delta-doped p+ layer playing any significant role in the junction formation was completely abandoned when it was demonstrated that similar excellent electrical properties could be achieved by boron CVD on n-type crystalline silicon substrates at temperatures as low as 400 ◦ C, at which no doping of boron in silicon is expected [7]. A first-principles quantum mechanics molecular dynamics simulation showed a very strong electric field across the a-B/c-Si interface systems where the charge transfer occurred mainly from the interface Si atoms to the neighboring B atoms This electric field appeared to be responsible for the creation of a depletion zone in the n-silicon, resulting in a rectifying junction formation. The PureB Process and Characterization of the Boron-Silicon Junction as a Radiation Detector

The PureB Process and Temperature Effects
Characterization of the Boron-Silicon Junction as a Radiation Detector
Responsivity
Resolution
Stability
Operational Speed
Boron-Silicon Junction Formation Premise Based on ab Initio Modeling
Band Bending for the Electronegativity Junctions
Findings
Conclusions
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