Mechanism of Chip Formation Process at Grinding

Abstract

The mechanism of chip formation process at grinding is described, which involves a high-speed interaction of abrasive grain and metal, which leads to a concentration of thermal energy in front of the dispersing element (grain), causing a locally concentrated shift in the metal microvolume. In “abrasive grain -metal” contact a dissipative structure is formed which existence is supported by exchange of energy and substance with environment. Due to shock compression of the metal microvolume with abrasive grain, shock-wave heating is realized, initiating emission of electrons ionizing the lubricating cooling fluid in the zone of formation of side micro-scratches left by abrasive. The results obtained in the course of the research can be used to explain the mechanisms of chip formation, as well as the course of the physical and mechanical processes occurring on the surface layers of the grinded workpieces. By controlling chip formation processes at high-speed grinding, by optimally selecting the appropriate ratios between cutting speed and other processing parameters, a reduction in process thermal density can be achieved, which, with the highest productivity, will allow to obtain the required quality of the surface layer of the workpieces and a given dimensional accuracy.