Mechanism and Experiment Study of Non-Contact Ultrasonic Assisted Grinding

Weiqing Huang,Yi Zhang,Chenglong Yang,Dawei An,Qunyou Zhong

doi:10.3390/act10090238

Abstract

Ultrasonic-assisted grinding processing can effectively reduce the surface roughness and enhance the processing efficiency in the processing of hard and brittle materials. However, the most common ultrasonic assisted grinding is a type of contact ultrasonic grinding where the grinding tool directly contacts the workpiece, which means that it is necessary to accurately control the pre-pressure of the grinding tool on the workpiece. The control of pre-pressure will inevitably increase the complexity of the grinding device, and it is easy to wear the workpiece because of improper pre-pressure control. In this paper, a non-contact ultrasonic grinding method is proposed and the machining mechanism of non-contact ultrasonic grinding is revealed. The resonant frequency of the ultrasonic vibration system and vibration amplitude of the grinding tool working face were simulated and experimentally tested, respectively. Then, the experiment of non-contact ultrasonic grinding of a sapphire wafer was carried out. The result showed that non-contact ultrasonic grinding of the sapphire wafer could reduce the surface roughness by 48.6%. Compared with traditional contact grinding of sapphire wafer under certain pre-pressure conditions, the experimental results show that non-contact ultrasonic grinding has better effects in reducing surface roughness, improving processing efficiency, and improving the quality uniformity of the workpiece machining surface.

Highlights

Sapphire material is a type of hard brittle material with excellent wear resistance and corrosion resistance
Xu W et al used ultrasonic bending vibration to assist the chemical mechanical polishing of sapphire substrates, and the results showed that ultrasonic vibration assisted chemical mechanical polishing can greatly reduce the surface roughness compared with traditional chemical mechanical polishing [16]
In the simulation, when the frequency was near 19.181 KHz, the vibration amplitude of the grinding tool working face was 4.55 μm

Summary

Introduction

Sapphire material is a type of hard brittle material with excellent wear resistance and corrosion resistance. Due to the difficulty of processing hard and brittle materials, it is necessary to improve traditional processing to meet the application requirements of hard and brittle materials [4,5,6]. The processing difficulty is mainly reflected in reducing the surface roughness of hard and brittle materials and improving the processing efficiency. Grinding is the main processing means to reduce the surface roughness of hard and brittle materials [7,8]. Traditional grinding cannot meet the requirements of the high machining accuracy of hard and brittle materials. Xu W et al used ultrasonic bending vibration to assist the chemical mechanical polishing of sapphire substrates, and the results showed that ultrasonic vibration assisted chemical mechanical polishing can greatly reduce the surface roughness compared with traditional chemical mechanical polishing [16]. Zhao B et al researched ultrasonic assisted elliptical vibration grinding of

Methods

Results

Conclusion