Abstract
New techniques for high-density circuit integration require parallel scanning in combination with the ability to reposition the circuit devices during implantation. A new family of high- and medium-current implanters utilizing a common end-station concept has been developed in a cooperative effort of design groups in Japan, Massachusetts and Texas. The new family utilizes rotating-disk, mechanically scanned batch processing with vacuum-lock wafer loading and unloading. A small, high-speed robot performs the in-air handling associated with loading the vacuum lock. The disk has a gimbal mount which permits two-axis tilting of the disk during implantation. Construction details and process capabilities of this implanter family are described and discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
