Abstract
In order to design a kind of mechanical vibration part with stable motion in ultrasonic composite vibration polishing equipment. firstly, the main working principle of ultrasonic composite vibration polishing equipment is briefly introduced. Secondly, the mechanical vibration structure of the design is analyzed theoretically, again, using ADAMS software to simulate the crankshaft connecting rod piston mechanism. When the crankshaft speed is 750r/min, the stroke of the piston is 90mm, which is similar to the theoretical analysis value. Finally, using ANSYS Workbench software to analyze the crankshaft statics. The analysis shows that the design of the mechanical vibration structure is reasonable, which provides a theoretical basis for the study of the mechanical vibration structure of ultrasonic composite vibration polishing equipment.
Highlights
With the development of other disciplines such as aerospace, VLSI and optical instruments, the quality requirements for the surface of the key parts needing precision machining are more and more high, and the characteristic dimensions of the substrates used in the IC circuits have reached the 45nm[1] with the large scale development trend
2 Working principle of ultrasonic composite vibrating polishing equipment Ultrasonic composite Vibration polishing working principle as shown in Figure 1., the workpiece is driven up and down by the mechanical vibration mechanism, and the workpiece is polished by the high speed relative motion of the abrasive and workpiece, and the energy assisted by the cavitation effect of ultrasonic vibration is used to remove the workpiece surface material by the aid of ultrasonic vibration, to achieve the workpiece surface polishing purposes
The results are similar to the theoretical calculation, when the crankshaft speed is 750r/min, the stroke of the piston is 90mm
Summary
With the development of other disciplines such as aerospace, VLSI and optical instruments, the quality requirements for the surface of the key parts needing precision machining are more and more high, and the characteristic dimensions of the substrates used in the IC circuits have reached the 45nm[1] with the large scale development trend. Traditional parts polishing relies on the experience of the workers to complete, but its processing cycle is long and low efficiency, and its processing quality is not stable [2], the current mainstream polishing method is composite vibration polishing, mainly including ultrasonic electrochemical composite polishing, ultrasonic-chemical composite polishing, ultrasonic auxiliary mechanical vibration composite polishing, ultrasonic fluid jet composite polishing, ultrasonic magnetic abrasive composite polishing and other polishing methods [3,4,5,6,7], but these polishing methods for the current requirements still have deficiencies. Domestic and foreign research institutions are still actively exploring new methods which have high-quality, high efficiency and low-cost surface processing. Because the stability of mechanical vibration structure of ultrasonic compound vibration polishing equipment directly affects the polishing quality of workpiece surface, the mechanical vibration part of ultrasonic compound vibration polishing equipment is analyzed in this paper
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