Abstract

Thermodynamic properties of thin films deviate strongly from those of bulk. The deviations are reported to originate from microstructure and from mechanical stress, whereas the contribution of both is unknown in particular. Focussing on the mechanical stress contribution and by using Pd1−xFex–H as a model system, it is shown that mechanical stress strongly changes phase transition pressures. The measured loading pressures shift up to 400mbars in contrast to 18mbars for bulk. These shifts relate to the film bonding to the substrate and can be affected by film detachment.

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