Abstract
Metal ribbon wiring attracts much attention for next-generation power-electronics interconnection technology, which requires wider capacity of electrical current in smaller package. The bonding methods of metal ribbons are to be optimized suitable for the larger bonding area than conventional thin string wires. We here use ultrasonic bonding for Al ribbon (1500 × 200 µm2) on to electroless nickel immersion gold (ENIG) finished copper substrate, and optimize the bonding process parameters to minimize the heat damage with sufficient bonding strength. The effect of the process parameters of ultrasonic power, bonding time and normal bonding force on bond formation at ambient temperatures have been investigated with field emission-scanning electron microscopy (FE-SEM) and energy-dispersive spectroscopy (EDS) analysis. Au–Al interfaces were characterized by FE-SEM following pull- and shear-test to effect separation of the bond joints. Bond stabilities were evaluated by lift-off phenomenon and fracture morphology after pull- and shear-test. The highest bonding strength indicated at 20 W (ultrasonic power), 1.8 s (bonding time), and 800 mN (normal bonding force). In this bonding condition, relative motion was occurred from center of gross sliding area over 60%. Based on those result, we confirmed the excellent ribbon bonding conditions and investigated bonding mechanism involved in relative motion.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
