Abstract

AbstractInP membranes have been microfabricated and released on top of an InP substrate. The release process comprises membrane photolithography, interlayer sacrificial etching of a InP/InGaAs/InP substructure and drying with CO2 at critical point. The mechanical response of the obtained small (40 µm) and thin (0.4 µm) membranes could be tested by nanoindentation. While keeping their epitaxial orientation through the fabrication process, delamination of the membrane was observed to occur before the indenting load reached 10 mN. Then cracking of the membrane was detected as a pop-in on the loading curves for loads larger than 10 mN.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call