Abstract

Tungsten doped amorphous carbon films are produced on silicon (100) wafers by post implantation of tungsten ions into the a-C:H films prepared by plasma immersion ion implantation and deposition (PIII&D). The film structures are evaluated by X-ray photoelectron spectroscopy, glancing angle X-ray diffraction, and Raman spectroscopy. The surface morphology is investigated by atomic force microscopy. The mechanical properties of the films including hardness and friction coefficients of the W-implanted layer are determined by nanoindentation and nanoscratch tests. The peak concentration of tungsten reaches 27 at.% and the formation of W–C nanocrystallites is observed. The W–C nanocrystallites and C–C bondings are found to change gradually with depth. The hardness which is slightly improved after W ion implantation is affected by the W–C strengthening phase, C–C structure, and compressive stress. Owing to energetic ion bombardment, the friction coefficient is reduced on the surface of the W-implanted layer and also increases gradually towards the bulk a-C:H film. The structural continuity enables the film to remain intact during the scratch test.

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