Abstract
Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.
Highlights
Structural features of nanomaterials determine their unique properties
Nanomaterials are used in practice due to their mechanical properties: resilience, plasticity, strength etc
In our time there are some theories explaining the change of value of yield point stress after injection of non-interacting second-phase particles to the matrix
Summary
Structural features of nanomaterials determine their unique properties. Properties of nanomaterials strongly depend from type of distribution, form, size and chemical composition of crystallites. Nanomaterials are used in practice due to their mechanical properties: resilience, plasticity, strength etc. The identification of regularities of influence of size effects to forming of nanomaterials’ properties is one of the most important problems of nanostructural materials science. In this paper copper films received by electroless and electrodeposit precipitation to metallic and dielectric substrates are researched. Thin structure of copper was studied by the method of transmission electron microscopy on the electronic microscope TESLA BS 500. Coverings are thinned by two-sided electrodeposite etching with using the method of “window” in 50% water solution of orthophosphoric acid
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